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It would be nice if there would be a possibility to add more than just the DIP pintable.
Some chips have different packages and currently only one is possible.
Furthermore the pins have additional data in the sym field, it would be more structured and really nice if it would be moved to a new field extra_syms.
And here how the ATTINY85.yaml could look with multiple packages:
Agreed; this would indeed be useful. When I started this project I was only doing through-hole hobbyist stuff, so DIPs were all I needed. The backend code at msarnoff.org/chipdb has no support for quad packages, and I imagine some CSS magic would be required to rotate the top/bottom labels 90 degrees.
I'm not sure when I'd have the time to migrate the existing entries to a schema like the one described above. If you or someone else would like to start a fork, you have my blessing.
It would be nice if there would be a possibility to add more than just the DIP pintable.
Some chips have different packages and currently only one is possible.
Examples:
http://datasheets.maximintegrated.com/en/ds/DS32kHz.pdf
http://www.atmel.com/dyn/resources/prod_documents/doc2586.pdf
Furthermore the pins have additional data in the
sym
field, it would be more structured and really nice if it would be moved to a new fieldextra_syms
.And here how the ATTINY85.yaml could look with multiple packages:
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